With the rapid development of integrated circuit process technology and the miniaturization of components, the requirements for product quality and yield are getting higher and higher. When developing nanometer-level process technology, the cleanliness of the wafer process or glass panel process environment is also relatively improved. At present, particle pollution is no longer the main factor that causes wafer defects and reduces product yield. Among them, suspended molecular pollutants (Airborne molecular pollutants, AMCs) have gradually replaced granular pollutants and become one of the main key factors affecting the yield of industrial processes.
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